13.56MHz Laboratory Plasma Etching Machine

The JJ-CCP100A laboratory plamsa etching machine is widely used for:

1. Surface cleaning-

The surface of the material often has organic dirt such as grease and oil and an oxide layer. Plasma treatment is required before bonding, welding, and painting to obtain a completely clean and oxide-free surface. The biggest feature of plasma cleaning technology is that regardless of the type of substrate to be processed, it can be processed, such as metals, semiconductors, oxides and most polymer materials (such as: polypropylene, polyester, polyimide, polychloride) Primitive materials such as ethane, epoxy, and even polytetrafluoroethylene can be handled well, and can be cleaned in whole, part, and complex structures. One of the important functions of cleaning is to improve the adhesion of the film, and at the same time help to improve the adhesion and wettability of the surface. The free radicals formed by plasma surface activation during the cleaning process can further add specific functional groups. The introduction of such specific functional groups, especially oxygen-containing functional groups, plays a significant role in improving the adhesion and wetting properties of the material. 

2. Wafer surface deglue

plasma deglue process is a very important process link in the micro-machining process. After the photolithography process, we often need to face the removal of the primer after development or the removal of the denatured photoresist after the dry etching process. In these links, whether the photoresist is removed completely and whether there is damage to the sample will be affected. It directly affects the subsequent process and the performance of the device. The flat-plate discharge method and water-cooled electrode of this equipment can withstand long-term high-power operation. Combining uniform process gas distribution greatly improves the uniformity and rate of glue removal.