Laboratory Desktop Single Unit Vacuum Wafer Bonder for Max 6inch Wafer

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Product Description

The CHD-WB061 desktop vacuum wafer bonder has functions of timing, vacuum,pressurization, heating,cooling. It is designed for wafer temporay bonding.Max Wafer size up to 6" wafers , 8" version can be customized. Max Temperature up to 200degree,and Pressure 0~3bar,adjustable. It offers micrometer-level precision for wafer-to substrate bonding applications,especially for GaN,SiC,Diamond,Ceramic,GaAs,InP,InSb etc.

Technical Parameter

Wafer Size	Up to 150mm in diameter,large size 200mm and 300mm can customize
Functions	timing, pressurization, heating, vacuum ,cooling
Processing control	Programmable control with LCD touch panel
Bond Pressure	0~3bar (adjustable)
Temperature Range	Room Temp to 200°C
Throughput	Depends on the process
Chamber Environment	Vacuum Pump included
Cooling method	Water cooling
Power Supply	AC 220V/50Hz