Product Description
SYJ-400 is a CE certified precise dicing and cutting solution for R&D Lab in Materials and Microelectronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components. The SYJ-400 saw can be computerized with a position accuracy of 0.01 mm. The sample stage with two angles adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance.
Technical Parameter
Voltage | AC110 or AC220V |
Motor | Brushless magnetic DC motor (110V) with variable speed up to 3,000 rpm Power consumption: 180W |
Effective Cutting Range | 3 dimension: X-axis: 8", Y-axis: 4", Z-axis: 4" |
Moving/Cutting Speed Range | X-axis: 1-50mm/min adjustable Y-axis: 1-50mm/min adjustable Z-axis: 1-20mm/min adjustable |
Accuracy | 0.0025 mm moving resolution and 0.01 mm position accuracy. |
Cutting Blades Kits | One 4" Dia x 0.35 mm thick fully sintered diamond blade Two pairs of flanges with 62 mm Dia. (for dicing) and 42 mm Dia. (for deep cutting) |
Dimension | 580mm L x 560mm W x 660mm H |
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