Product Description
SYJ-150 low-speed diamond cutting machine is a CE certified cutting equipment suitable for precision cutting of material analysis samples, such as various crystals (sapphire, garnet, etc.), ceramics, cement, glass, rock samples, mineral samples, metals, plastics, PCB boards, medical materials, dental materials, refractory materials, building materials, composite materials, and organic polymer materials. The SYJ-150 low-speed diamond cutting machine is particularly suitable for cutting or slicing materials, and can also cut samples at a certain angle. The spindle speed is infinitely adjustable, and the cutting process relies on a micrometer to adjust the size of the cut sample, ensuring precise size control.
Technical Parameter
Voltage | AC220V,50W |
Main Axis rotating speed | 25~750rpm |
Cutting depth | 25mm adjustable |
Max distance | 40mm |
Accuracy | 0.01mm |
Clamp | Horizontal:360° Vertical:±15° |
Cutting Saw Size | Ø76mm~Ø100mm |
Dimension | 365×280×235mm |
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