Henan Chuanghe Laboratory Equipment Co., Ltd.

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SYJ-150 Low Speed Diamond Cutting Machine

Product Description

SYJ-150 low-speed diamond cutting machine is a CE certified cutting equipment suitable for precision cutting of material analysis samples, such as various crystals (sapphire, garnet, etc.), ceramics, cement, glass, rock samples, mineral samples, metals, plastics, PCB boards, medical materials, dental materials, refractory materials, building materials, composite materials, and organic polymer materials. The SYJ-150 low-speed diamond cutting machine is particularly suitable for cutting or slicing materials, and can also cut samples at a certain angle. The spindle speed is infinitely adjustable, and the cutting process relies on a micrometer to adjust the size of the cut sample, ensuring precise size control.

Technical Parameter

VoltageAC220V,50W
Main Axis rotating speed25~750rpm
Cutting depth25mm adjustable
Max distance40mm
Accuracy0.01mm
Clamp 

Horizontal:360°

Vertical:±15°

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Cutting Saw SizeØ76mm~Ø100mm
Dimension365×280×235mm


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